SPICE–PAC version 2G6c: An Overview

Zuberek, W. M. (1989) SPICE–PAC version 2G6c: An Overview. Technical Report. Memorial University of Newfoundland, St. John's, Newfoundland and Labrador.

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Abstract

SPICE-PAC is a simulation package that is upward compatible with the popular SPICE-2G circuit simulator; it accepts the same circuit description language (with only a few minor exceptions) and provides the same circuit analyses, but it also supports a number of extensions and refinements which are not available in the original SPICE program. The most important difference, however, between SPICE and SPICE-PAC is in their internal organizations; SPICE is a program with one, fixed sequence of operations while SPICE-PAC is a collection of loosely coupled simulation “primitives” that can be “composed” in many different ways, as required in a particular application. This flexibility of SPICE-PAC is quite important in “integrated” applications, i.e., applications in which circuit simulation is combined with other software tools, for example, optimization methods, statistical analysis, symbolic simula- tion, high-level (e.g., behavioral) simulation, and so on. This report briefly outlines main features of SPICE-PAC, compares SPICE-PAC with the SPICE circuit simulator, sketches SPICE-PAC’s basic applications, and then presents several recent extensions to the package. Simple examples are used to illustrate these extensions. A more detailed description of the package is given in a Technical Report: “SPICE-PAC 2G6c - User’s Guide”, available from the Department of Com- puter Science, Memorial University of Newfoundland, St. John’s, Canada A1C- 5S7 (and also through anonymous ftp at ftp.cs.mun.ca in /pub/techreports as tr-8902.ps.Z).

Item Type: Report (Technical Report)
URI: http://research.library.mun.ca/id/eprint/14559
Item ID: 14559
Additional Information: Technical Report #8903
Keywords: Circuit simulation, computer-aided design software, SPICE, SPICE-PAC
Department(s): Science, Faculty of > Computer Science
Date: March 1989
Date Type: Publication
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