Moazzez, Behrang and O’Brien, Stacey M. and Merschrod S., Erika F. (2013) Improved Adhesion of Gold Thin Films Evaporated on Polymer Resin: Applications for Sensing Surfaces and MEMS. Sensors, 13. pp. 7021-7032. ISSN 1424-8220
- Published Version
Available under License Creative Commons Attribution Non-commercial.
We present and analyze a method to improve the morphology and mechanical properties of gold thin films for use in optical sensors or other settings where good adhesion of gold to a substrate is of importance and where controlled topography/roughness is key. To improve the adhesion of thermally evaporated gold thin films, we introduce a gold deposition step on SU-8 photoresist prior to UV exposure but after the pre-bake step of SU-8 processing. Shrinkage and distribution of residual stresses, which occur during cross-linking of the SU-8 polymer layer in the post-exposure baking step, are responsible for the higher adhesion of the top gold film to the post-deposition cured SU-8 sublayer. The SU-8 underlayer can also be used to tune the resulting gold film morphology. Our promoter-free protocol is easily integrated with existing sensor microfabrication processes.
|Additional Information:||Memorial University Open Access Author's Fund From special issue titled Nanochemical Sensors|
|Keywords:||thin films, adhesion, elastic modulus, roughness, biomedical cantilever sensors, microfluidic sensors, SU-8, metal, gold|
|Department(s):||Science, Faculty of > Chemistry|
|Date:||13 May 2013|
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